The 3C and semiconductor industries are accelerating toward miniaturization and precision, imposing stringent requirements for production environment cleanliness (Class 1000 standard), material handling accuracy (±1mm) and shock resistance rating (<0.3g). In 2024, the market size of China's semiconductor AMHS reached 8.69 billion RMB, and the OHT crane solution has become a standard configuration for 12-inch wafer fabs.

The high-mix, low-volume production mode accounts for over 60% in the 3C industry, which is in urgent need of flexible logistics to support the production line's demand for 20 model changes per day. AGV/AMR has become the key to breaking the dilemma through cluster scheduling and environment-adaptive design.